Test & Measurement
GOEPEL electronic will exhibit leading Test Equipment at NEPCON China 2011
At this year’s NEPCON China in Shanghai, GOEPEL electronics Ltd. Asia will present its latest offerings in Multi-Dimensional Boundary Scan Instrumentation as well as chip embedded test, debug and programming tools.
By vGOEPEL introduced more than 35 new and partly revolutionary Boundary Scan software and hardware products in 2010 and 2011, and will demonstrate how users can save time and money by applying technology-leading test equipment. Visitors can also inform about Boundary Scan integration opportunities into other automated test equipment such as In-Circuit-Testers, Flying Probers, MDA, Functional Test Systems and Automated Optical Inspection Systems.
From May 11th to 13th 2011, visitors are welcome to find how GOEPEL electronic can provide test solutions to “Get the total Coverage!” for design, production and test engineers.