G-TAP – versatile Contacting Solution for Assembly Test

27th November 2012

Nat Bowers

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The G-TAP is not a single product but an overall concept, because the module can be utilized in stand-alone operations as well as an integrated solution in existing electronic and optical test systems such as Flying Probers, In-Circuit Test or AOI systems.

“In the development and production of electronic assemblies the problems in contacting are well known. The G-TAP is more than a single solution as it can be applied multilaterally and flexibly for all upcoming test and programming tasks”, says Martin Borowski, Technology Expert in GOEPEL electronic’s Boundary Scan Division. “The tiresome selection between the utilization of plug connectors, test points, or both, and their corresponding benefits and disadvantages is now omitted. The G-TAP kills all birds with one stone because it provides the ideal solution for all occurring contacting requirements.”

About the G-TAP:

During G-TAP development special emphasis was placed on the opportunity to combine several test methods. Additionally, there is an inline solution that can compensate PCB position tolerances of up to 1 mm, automatically adapting to the UUT. This enables utilization in test systems not designed for probe contacting, such as classical AOI systems. The efforts in integration are very low as required signals are supplied via a central unit.

The precondition is a special Pad design on the assembly. It contains altogether 11 signals: the JTAG bus, voltage supply and potentially required add-on signals. Therewith it is possible to execute electric tests (Boundary Scan, software emulation via VarioTAP) and any programming tasks (on-chip Flash, external Flash, FPGA/CPLD). The Pad design consists of vias, enabling contacted from the bottom and top sides. Due to requirements such as initial operations of prototypes and serial production or repair, both manual and automated adaptation are available.

The G-TAP concept is registered for patent.