LTE-Advanced data rates demonstrated on Intel XMM 7260 platform

For global handset suppliers and leading operators, it is important that devices are able to support the full range of 3GPP configurations up to 40MHz of aggregated bandwidth and concurrent throughput of up to 300 Mbps in downlink and 50Mbps in uplink. Using the MD8430A signalling tester, together with the RTD advanced test case development and protocol analyser, Intel has been able to establish an end to end data connection with concurrent 300 Mbps in downlink and 50Mbps in uplink.

This requires that both the signalling tester and device platform are capable to support the LTE-Advanced Carrier Aggregation technology with 20+20MHz bandwidth. The advanced R&D features and high stability of the tester enables users to rapidly enable the functionality within the device platform and verify the performance capability.

Olaf Sieler, Director of Global Accounts for Anritsu commented, “Anritsu is extremely proud to be at the leading edge of Intel’s device testing, providing our world class test systems and services to enable Intel to rapidly verify the capability of new technologies and devices”. “Last year, Intel entered the market for multimode LTE. This year, we’re delivering a highly competitive LTE-Advanced experience with our new 7260 platform as demonstrated with Anritsu,” said Aicha Evans, corporate vice president of wireless platform research and development at Intel.