/> The new Mod5 Series design provides a compact, surface mount test solution for micro-BGA chipsets used in applications such as handheld, mobile, and wireless product development. Precision machined spring probes with industry proven solder balls ensure high reliability performance. Features include:

* Accommodates BGA packages up to 12mm sq. (22 x 22 rows), with larger sizes available upon request
* Precision machined spring probes offer high bandwidth with very low insertion loss
* Compact size (20 x 27mm) enables use on design boards with small keepout zone
* Flip-Top BGA Socket’s easy actuation with simple cover and turn-screw heat sink enables quick insertion and extraction
* SMT design lowers test board costs by allowing use of alternative pad plating (vs. gold) and eliminating the need for expensive hardware and mounting holes which interfere with PCB traces
* Modular design enables simple reflow process, similar to BGA device
* Metallic probes offer proven reliability over elastomeric sockets and long-life (spring probe contact system life is 200,000 cycles minimum)
* Additional mounting options and custom designs available