Test & Measurement

ACS Test System Now Completes Wafer Level Reliability Testing up to Five Times Faster

30th April 2008
ES Admin
0
Keithley Instruments has enhanced its Automated Characterization Suite (ACS) software to include optional wafer level reliability (WLR) test tools for semiconductor reliability and lifetime prediction testing applications. Version 4.0 builds on the ACS software’s existing single- and multi-site parallel test capabilities, adding a database capability, as well as software tools and optional licenses for the new Reliability Test Module (RTM) and ACS Data Analysis capabilities.
Together, the new Reliability Test and Data Analysis tools allow ACS-based test systems to produce lifetime predictions as much as five times faster than traditional WLR test solutions. By accelerating WLR testing during the technology development, process integration, and process monitoring phases of creating new integrated circuits, ACS systems can reduce time to market for new products significantly.

ACS-based test systems have the hardware configuration flexibility necessary to address a wide range of semiconductor characterization needs at the device, wafer, or cassette level. They can incorporate either Keithley’s Series 2600 System SourceMeter® instruments, the company’s Model 4200-SCS Semiconductor Characterization System, or both.

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