Test & Measurement
A typical workflow of a power semiconductor device holds many measurement challenges
The recent drive toward greater energy efficiency has created an increasing demand for better high power semiconductor devices such as diodes, FETs, IGBTs and others. New technologies hold the promise of higher performance, including lower ON-state losses, lower OFF-state leakage, faster switching, and reduced loss while switching.
WithThe next step (or the first step in many situations) is to fabricate a real device. Characterisation on this device starts out with taking a simple I-V (current-voltage) curve to determine basic device characteristics. Usually, the designer knows what he or she expects the device to do but not what the device actually does. Again, a curve tracer can be a simple and efficient choice for this task. It allows the designer to apply a controlled voltage carefully, read back the current to determine if junctions and interconnects designed actually exist, and discover the typical breakdown voltage or ON current the device can handle.
Connecting a curve tracer safely to a probe station is a common test problem in this situation. Curve tracers were typically intended to test packaged parts, but it is much more efficient to test devices on the wafer directly, eliminating the cost and time of packaging the part. The newest generation of source measurement units (SMUs), including Keithley’s Models 2651A and 2657A High Power System SourceMeter instruments, provide safer and more accurate connections, and better control over the voltage and current. The designer can control the instrument using the front panel knob and display or via the LXI-compliant web page embedded in the instrument. Another option is to connect the instrument to an external controller running an application created using something like Keithley’s ACS Basic Edition Test Software for Component and Discrete Devices, which provides a simple Trace Mode that provides precise control of the voltage and read back of the current.
You can read the rest of this article in the September issue of Electronic Specifier Design by clicking here.