Texas Instruments brings you the latest in Power

How GaN switch integration enables low THD and high efficiency in PFC

The need for cost-effective solutions to improve power factor correction (PFC) at light loads and with peak efficiency while shrinking passive components is becoming difficult with conventional continuous conduction mode (CCM) control.

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Using interleaved ground planes to improve noise filtering from isolated power supplies

Historically, automotive electronics have been powered off the same 12-V lead-acid battery used to start the vehicle. Even with surges as high as 42 V, which could occur if the generator were running and the battery cable was disconnected, voltages stay in the safety extra-low voltage (SELV) range below 60 VDC. Thus, it was not necessary to worry about the spacing of conducting printed circuit board (PCB) traces to avoid electrical shock hazards in automotive circuitry.

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Isolating a SEPIC

If someone asked you what topology to use for an isolated, low-power output, chances are your first thought would be a flyback. Although a flyback is an excellent topology with benefits such as low cost, low component count and ease of adding additional outputs, it still has several drawbacks.

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The TPS62883 evaluation module (EVM) is designed to help users easily evaluate and test the operation and functionality of the TPS6288x-Q1 dual-phase buck converters, which are intended for automotive applications. The EVM converts 2.7V to 6V input voltage to a regulated 0.75V output voltage with 0.5% accuracy at output current up to 30A.

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Powering next-generation ADAS processors with TI Functional Safety-Compliant buck regulators

The rapid evolution of advanced driver assistance systems (ADAS) increases the complexity and demand for real-time data processing, which requires high-performance processors to handle tasks such as object recognition, sensor fusion and decision-making. This increased complexity introduces new challenges on the power-management side.

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PMP41062

This reference design is an integrated USB Type-C® power delivery (PD) and charging reference design for 4- to 10-cell batteries for applications such as, power tool charger with USB Type-C port, vacuum cleaners, portable power station and more. Using the TPS25751, a highly integrated USB Type-C PD controller which integrates a fully-managed reliable power path switch inside to reduce size and external component.

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USB Type-C and USB Power Delivery: Designing for both Extended Power Range and battery-powered systems 

With applications in personal electronics, automotive, industrial and enterprise systems, USB Type-C (USB-C) is an industry-standard connector that enables the transmission of both data and power on a single interface. USB Power Delivery (PD) is a standard using the USB-C connector that increases the capabilities and features of a USB-C interface. Until recently, the USB PD 3.0 specification allowed for up to 100W (20V, 5A) of power, now called Standard Power Range (SPR), to flow in both directions. The latest USB PD 3.1 specification increases the power range to 240W (48V, 5A), now called Extended Power Range (EPR), through a USB-C cable. 

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Achieving functional safety compliance in automotive offbattery buck preregulator designs

Any influential technology emanates a set of risks, which can be especially serious in automotive safety-related systems. The purpose of the International Organization for Standardization (ISO) 26262 series of standards, Road vehicles – Functional safety, is to mitigate risks in road vehicles by providing guidelines and requirements for the functional safety of automotive electrical and electronic systems.

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TPS62883-Q1

The TPS62880-Q1, TPS62881-Q1 , TPS62882-Q1, and TPS62883-Q1 are a family of pin-to-pin 12A, 20A, 24A, and 30A synchronous, dual-phase, step-down DC/DC converters.

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USB Type-C Power Delivery 3.1 Extended Power Range + Battery charger Application Demo

USB-C PD3.1 introduced the Extended Power Range (EPR) which increased the USB-C maximum power to 240W at 48V. This video showcases USB-C Power Delivery and battery charging solutions acting as a 240W power source and 240W power sink.

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TPS62876-Q1

The TPS6287x-Q1 family implements an enhanced DCS-control scheme that combines fast transient response with fixed-frequency operation. Devices can operate in power save mode for maximum efficiency, or forced-PWM mode for best transient performance and lowest output voltage ripple.

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LMG2100R044

The LMG2100R044 device is a 90V continuous, 100V pulsed, 35A half-bridge power stage, with integrated gate-driver and enhancement-mode Gallium Nitride (GaN) FETs. The device consists of two 100V GaN FETs driven by one high-frequency 90V GaN FET driver in a half-bridge configuration.

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LMG3100R017

The LMG3100 device is a 90V, 97A Gallium Nitride (GaN) with integrated driver. The device consists of a 100V GaN FET driven by a high-frequency GaN FET driver. The LMG3100 incorporates a high side level shifter and bootstrap circuit, so that two LMG3100 devices can be used to form a half bridge without needing an additional level shifter.

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UCC33420-Q1

UCC33420-Q1 is an automotive qualified DC/DC power module with integrated transformer technology designed to provide 1.5W of isolated output power. It can support an input voltage operation range of 4.5V to 5.5V and regulate 5.0V output voltage with a selectable headroom of 5.5V.

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CSD95430

The CSD95430RRB NexFET power stage is a highly optimized design for use in a high-power, high density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package.

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TPS2HCS10-Q1

The TPS2HCS10-Q1 device is a dual channel, smart high-side switch controlled through a serial peripheral interface (SPI). The device integrates robust protection to ensure output wire and load protection against short circuit or overload conditions. The device features overcurrent protection which is configurable via SPI in two ranges of thresholds.

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Smart Fuse Evaluation Module

The HSS-HCMOTHERBRDEVM and corresponding daughter cards (such as the HSS-2HCS10EVM) are used to showcase and evaluate all features of the Texas Instruments' smart fuse high-side switch portfolio. The motherboard is designed to be used with several different daughter cards enabling the use of a single host EVM for a variety of different high-side switches with varying on-resistances and functionality. A pre-flashed MCU is included with each HSSHCMOTHERBOARDEVM to act as a USB-to-SPI bridge and allow the user to seamlessly configure/ manipulate the device. This MCU communicates with a Windows® host GUI application titled Smart Fuse Configurator to allow for full configuration and evaluation of the attached high-side switch.

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CSD96416

The CSD96416 NexFET power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Breaking the mold: How a new magnetic packaging technology will reshape the future of power modules

A global team of TIers persisted through challenges to develop the new MagPack packaging technology for power modules, a breakthrough that will help advance the future of power design.

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MagPack technology: Four benefits of new power modules that can help you pack more power in less space

Are you working to double the data rate of your next-generation optical module, but within the existing form factor and power budget? Or are you being asked to cram one more sensor into your machine vision system, but are already out of board space and dissipating too much power?

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XPSM828303PVCBR

The TPSM82830x are an easy-to-use, synchronous, step-down, DC/DC module family with integrated inductor and EMI reduction technologies. Based on the DCS-Control topology, the devices have a fast transient response yet with small output capacitance.

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TPSM82816

TPSM8281x are a family of pin-to-pin, 1A, 2A, 3A, 4A, and 6A compatible high efficiency and easy to use synchronous step-down DC/DC power modules with integrated inductors. The devices are based on a fixed-frequency peak current-mode control topology. The devices are used in telecommunication, test and measurement, and medical applications with high power density and ease of use requirements.

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Best of Power Tips

The “Best of Power Tips” e-book compiles the most popular posts from our long-running series with Electronic Design News (EDN). Our power management experts created the Power Tips series to provide insights on common tips and tricks for addressing specific power-supply design challenges. With over 150 articles in the series, we've selected 25 of the most popular articles and compiled them into our “Best of Power Tips" e-book.

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Make sure your optocoupler is properly biased

In isolated power supplies, optocouplers pass the feedback signal across the isolation boundary. Optocouplers contain both a light-emitting diode (LED) and a photo detector. Current flowing through the LED results in a proportional current flowing in the photo detector.

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Designing a flyback DC/DC converter

This video series is dedicated to designing a flyback DC/DC converter. We will guide you through choosing the right topology for your design, explain the fundamentals of flyback converters and discuss design considerations and procedures.

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How to improve flyback efficiency with a nondissipative clamp

In the standard form of a flyback converter, the leakage inductance of the transformer creates a voltage spike on the drain of the primary field-effect transistor (FET). Preventing this spike from becoming excessive and damaging, the FET requires a clamping network, usually with a dissipative clamp.

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