TDK’s new ultrasonic ToF sensor at electronica 2024
TDK has unveiled its new InvenSense SmartSonic ICU-10201 high-performance ultrasonic Time-of-Flight (ToF) sensor with an embedded processor and extended memory space.
To learn more about this new product offering, Electronic Specifier’s Harry Fowle spoke with Massimo Mascotto, Director of Product Marketing for MEMS Sensor Business Group at TDK Corporation.
On-chip processing levelling up the game
At the heart of this new product offering is the embedded processor which enables on-chip processing for improved performance and lower overall power consumption. Designed for IoT and robotics applications, the device is capable of obstacle avoidance, soft surface detection, liquid level measurement, and proximity/motion sensing.
Mascotto was more than happy to divulge on how this is being achieved: “This latest family of ToF sensors are using a MEMS piezoelectric micromachined ultrasonic transducer (PMUT) which features a low-power SoC in a compact package.
“Additionally, the ICU-10201 embeds a new, more-powerful on-chip processor that out performs previous generations. This enhanced processing power means that we are apply to run a wide range of application algorithms on-device, massively offloading the MCU.
“The ToF sensor itself is able to provide millimetre-accurate as well as robust range measurements up to 1.7m away no matter the lighting or target material.”
A smarter solution
This combination of features means that smarter, yet low-power solutions can be designed – resulting in greener, safer, and more aware final products. The ICU-10201 comes in a compact 3.5 x 3.5mm² package, available now.
Main applications of this new ToF sensor include obstacle avoidance for robotics and drones, liquid level measurement for coffee machines and dispensers, as well as surface composition and cliff detection for robot-vacuums.