Sensor power unified at Sensor+Test 2019

Represented at the booth will be TDK, EPCOS, InvenSense, Micronas, Chirp, and Tronics branded products. The Sensor+Test exhibition will take place in Nuremberg, Germany, with TDK at booth 204 in hall 1.

Product highlights

Micronas magnetic sensors and embedded motor controllers: The first Micronas TMR-based sensor family CUR 423x was developed for current measurements in Automotive and Industrial applications and is marketed under the trademark curSENS. The CUR 423x sensors allow for non-intrusive, galvanically isolated contactless current measurements based on closed-loop TMR technology. 

The sensors are ISO26262 ASIL-B ready and AEC-Q100 qualified. A very good signal-to-noise ratio and a total error below one percent (full scale) over temperature enable precise current measurements and the smallest module integration since no magnetic-field core concentrator is required. Furthermore, the extensive portfolio of Micronas magnetic-field sensor solutions based on the so-called Hall effect and Micronas embedded motor controllers for automotive and industrial applications will be on display.

EPCOS temperature & pressure sensors: TDK develops and manufactures high-accuracy temperature and pressure sensors with excellent media resistance and long-term stability, serving the automotive, industrial, and consumer electronics markets. With world-class expertise and technology combined with decades of experience in design, simulation, validation, and mass production, TDK is a global partner to market-leading customers. 

The EPCOS H650 temperature sensor element is designed to measure temperatures up to 650°C. The NTC sensor element offers high-precision measurements with a temperature tolerance of approximately ±1 K at 200°C. These new high performance EPCOS pressure sensing elements have excellent long term stability and are designed for pressure ranges from 100 mbar up to 40 bar with package sizes down to 0.65x0.65mm.

Chirp ultrasonic ToF sensors: MEMS (micro-electrical mechanical systems)-based Chirp sensor solutions utilise an array of small ultrasound transducers to send out a pulse of sound waves and then detect echoes returning from targets in the sensor’s field-of-view. 

By calculating the ToF, the technology can determine the location of an object relative to the device and can trigger a programmed behaviour.

InvenSense motion and sound sensor solutions: InvenSense solutions combine MEMS sensors, such as accelerometers, gyroscopes, compasses, and microphones, with proprietary algorithms and firmware that intelligently process, synthesise, and calibrate the output of sensors, maximising performance and accuracy. 

InvenSense motion tracking, audio and location platforms, and services can be found in mobile, wearables, smart home, industrial, automotive, and IoT products. Sensors+Test will showcase new InvenSense capacitive pressure sensor solutions, analog and digital MEMS microphone solutions, and 6-axis (gyroscope and accelerometer) technologies.

Tronics high performance MEMS gyros and accelerometers: With its portfolio of Tronics sensors, TDK providers of both closed-loop MEMS accelerometers and gyros, taking MEMS inertial sensors to an unrivalled level of performance. 

Standard Tronics products are manufactured in the company’s own wafer fab, assembly, and calibration lines, all located in France, and are well-suited for system manufacturers with stringent requirements for high bias stability, high-performance inertial sensors. They are used in applications such as precision navigation, motion tracking and control, as well as optical stabilisation.

TDK TMR angle sensors: The new TDK TMR angle sensor, TAD2141 with digital output, offers a guaranteed angle accuracy of ±0.2°. At room temperature, the sensor achieves an accuracy for angle error of only ±0.05°. The sensor is capable of contactless angle measurement sensing up to 360° within a temperature range of -40 to +150°C. 

The main applications of the sensor include industrial and robotics, as well as automotive with a focus on future systems for automated driving.