CMOS image sensors cover 2D, 3D applications

The Mira016 image sensor is a compact (0.16MP), enhanced near-infrared (NIR), global shutter image sensor designed for 2D and 3D industrial, robotics, consumer wearables and machine vision applications.

This high sensitivity, small pixel size (2.79 µm) sensor features state-of-the-art back-illuminated sensor (BSI) technology.

Its small 1.8 mm² size, configurability, and high sensitivity both in visual as well as NIR wavelengths make the Mira016 well suited for many 2D and 3D applications, including eye, head, hand, and environment tracking in augmented reality and virtual reality (AR/VR).

The Mira016 sensor offers a MIPI CSI-2 interface, allowing easy connection with a variety of processors and FPGAs, and its low active power and high sensitivity in near-infrared (NIR), delivers increased measurement range, as well as overall system power consumption optimization, which is key for battery-powered consumer and industrial applications like facial authentication for mobile devices and points of payment.

Programmable registers, context switching, on-chip processing, advanced power and temperature management, and an illumination synchronization trigger make the Mira016 a perfect choice for authentication, 3D sensing, wearables and extended battery-powered applications.