ROHM's thermal analysis function verifies power devices

ROHM Solution Simulator makes it possible to carry out a variety of simulations for free – from component selection to individual device and even system-level verification. This enables easy and accurate verification of ROHM products such as SiC devices in power semiconductors, driver/power supply ICs, and passive components (i.e. shunt resistors) in solution circuits under close to actual application conditions. 

ROHM released its ROHM Solution Simulator in 2020 – in line with the company’s overall focus: developing and supporting application circuits that maximise the characteristics of driver ICs and power devices designed to supply high power in the automotive and industrial equipment markets. In this context, the ROHM Solution Simulator enables full circuit verification of power semiconductor and analog ICs. The tool is free of charge, and the software has been well received for its applicability and high accuracy.  

The newly added thermal analysis function can be implemented in solution circuits for devices and applications where heat is likely to become an issue in electronic circuit design. Examples are PTC heaters (heaters specifically designed for electric vehicles without internal combustion engines) equipped with IGBTs and shunt resistors as well as DC/DC converter ICs and LED drivers in order to meet the increasing demand to simulate temperature during circuit operation. This is the only simulator in the industry that enables web-based electrically and thermally coupled analysis of not only of the semiconductor chip (junction) temperature during operation, but also pin temperatures as well as thermal interference of board components on solutions circuits that include both power semiconductors and ICs along with passive components. As a result, thermal analysis that used to take as much as a day can now be performed in about ten minutes. This allows users to quickly and easily check the temperature of various parts of the device before prototyping (instead of after as is currently the case), reducing the need for rework. At the same time, the amount of development resources required for applications where heat is an issue decreases.