Renewables

DEK Solar shows the way to cost savings and process improvements

15th October 2012
ES Admin
0
DEK Solar has announced the result of metallisation tests that show the possibility for significant cost savings and process improvements in the print process. DEK launched the paper, entitled “Fine Line Printing of Front Side Metallisations Using Ultra Fine Mesh and Stencil Technologies, at the recent EU PVSEC exhibition in Frankfurt, Germany.
It was developed in collaboration with DuPont Microcircuit Materials (MCM), a leading global manufacturer of high efficiency photovoltaic metallisation pastes. The two companies evaluated ultra-fine wire mesh screens and metal stencils in both single and dual printing processes in order to investigate whether it was possible to improve cost per watt through increasing cell efficiency and reducing paste consumption.

Key findings were:

· Use of ultra-fine meshes in single print mode can enable reductions in paste consumption up to 30% without effecting cell efficiency. In this mode the busbar thickness is significantly reduced causing a reduction in solder adhesion forces

· In dual print mode the use of a stencil to print the fingers and a 400 mesh to print a dedicated busbar paste can achieve total laydown reductions up to 40% and a relative increase in efficiency > 0.5% . Use of dedicated busbar paste enables high solder adhesion forces to be maintained.

Tom Falcon, Senior Process Development Specialist at DEK Solar comments, “We’re really excited by the results of these tests, and the potential impact this might have on solar cell production in the future. By showing that significant cost savings can be achieved by reducing silver usage, whilst also generating improvements in both electrical efficiency and reliability, we feel that both solar cell manufacturers and consumers will benefit.

DEK and DuPont MCM carried out these tests over a period of 6 months at the DuPont MCM facility in Bristol.

Featured products

Upcoming Events

No events found.
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier