Power

600mA DC/DC Converter Improves Power Efficiency And Density For Portable Electronics

9th June 2009
ES Admin
0
Analog Devices has expanded its family of miniature switching regulators with a new 3-MHz step-down dc-to-dc converter optimised for better energy efficiencies in battery-powered portable devices. Balancing low operating input voltage capability, low quiescent current, and small size, the 600-mA ADP2108 dc-to-dc converter offers designers more flexibility in meeting strict system power and PCB (printed circuit board) area budgets without increasing battery capacity, an important concern when designing for small, handheld devices, such as mobile handsets or portable inventory scanners, or rechargeable medical equipment.
Efficient power conversion is very important to extending usage-time for battery-powered devices. Like its 6MHz ADP2121 sister device, the new 3MHz ADP2108 dc-to-dc converter operates from an input voltage as low as 2.3 V to provide excellent conversion efficiency, transient response, and protection. This low operating voltage allows designers to fully use the available battery energy for 2.5-V and 3-V power loads before recharging, which can eliminate the requirement of a more expensive buck-boost regulator in some applications. During light load conditions, the ADP2108 switches to a low-quiescent power-save mode for additional battery life savings.

Space savings and heat management are also important design considerations for portable devices and modular POL (point-of-load) systems. The ADP2108 device requires only three tiny external 0603 size components, which when combined with greater than 93 percent conversion efficiency, enables designers to support a higher load in a smaller area. In addition, ADI offers the ADIsimPower(tm) voltage regulator design tool and other downloadable power management tools that facilitate the design of high-efficiency dc-to-dc conversion blocks with reduced risk.

The ADP2108 is available in two package type options. The 1 mm x 1.5 mm x 0.6 mm WLCSP (wafer-level chip scale package) provides an ultra-low profile size for portable devices, such as mobile handsets, with stringent board space limitations, particularly on the z-axis. The 3 mm x
3 mm x 1 mm TSOT-23 (thin small outline transistor) package offers easy assembly for printed circuit board designs.

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