TI releases its new MagPack technology for power modules

These power modules utilise TI’s proprietary MagPack integrated magnetic packaging technology, reducing their size by up to 23% compared to competing modules. This advancement allows designers of industrial, enterprise, and communications applications to achieve previously unattainable performance levels. Notably, three of the six new devices, the TPSM82866A, TPSM82866C, and TPSM82816, are the industry's smallest 6A power modules, providing a leading power density of nearly 1A per 1mm² of area.

Innovations in power module design

In power design, size is critical. Power modules simplify power designs and save valuable board space by combining a power chip with a transformer or inductor in one package. By leveraging TI’s exclusive 3D package moulding process, MagPack packaging technology maximises the height, width, and depth of the power modules to deliver more power in a smaller space.

The magnetic packaging technology includes an integrated power inductor with proprietary, newly engineered material. As a result, engineers can now achieve best-in-class power density, reduce temperature and radiated emissions, and minimise both board space and system power losses. These benefits are particularly significant in applications such as data centres, where electricity is a major cost factor, with some analysts predicting a 100% increase in demand for power by the end of the decade.

“We've already seen excitement from customers with strict application height and space requirements, who find the smallest size and improved density benefits particularly attractive. For example, the size benefits are especially important and applications such as optical modules for data centres, where being able to minimise the footprint of the power components allows more board space for processing,” commented Florian Sampson, Product Line Manager at Texas Instruments.

“New packaging is reshaping our industry. TI’s new MagPack packaging technology is inherently different because nothing like it exists presently in the market. It's been nearly a decade in the making and a global collaboration between R&D experts and TI’s skilled engineers. The backpack packaging technology leverages TI’s exclusive 3D-package moulding process to maximise the usable package area in the height, width and depth of the power module. It includes an integrated power injector with proprietary newly engineered material to achieve the tightest integration of silicone packaging,” added Anton Winkler, Business Lead Buck Converter Modules at Texas Instruments.

Device specifications