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Thermal compound enables controlled dispensing for power supplies

7th September 2017

Alice Matthews

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Datasheet

A division of Parker Hannifin, Chomerics Europe, has introduced its TC50 high performance thermal compound for conducting heat between hot electronic components and heatsinks or enclosures. Importantly, the heavy paste-like consistency of this one-component, RoHS compliant product can be easily dispensed in a controlled manner to produce different thicknesses in line with specific application requirements. TC50 provides low thermal impedance at multiple gaps to permit the deployment of commonly used spreaders.

Furthermore, it only requires low compressive force to deform under assembly pressure. As a result, any stress on components, solder joints and leads is minimised.

Suitable for automated dispensing machines serving a wide range of bond line applications, as well as rework and field repair situations, TC50 thermal compound is aimed at automotive ECUs (electronic control units), power supplies and semiconductors, as well as memory and power modules, microprocessors and consumer electronic products. It can be packaged in syringes or cartridges, or bulk packaged in pails as required.

Delivering thermal conductivity of 5.5W/m-K and heat capacity of 1J/g-K, TC50 is typically suitable for all bond lines over 0.15mm thick.