Semikron introduces IGBT and rectifier modules with new SPT+ chip technology

SEMIKRON has introduced SEMiX® IGBT and rectifier modules with new SPT+ chip technology. The soft-punch-through (SPT) chip design is based on a planar-gate/punch-through IGBT technology. It offers benefits such as lower switching losses, smaller chip sizes (and therefore lower cost) for the same current-handling capability, positive temperature coefficient and a high switching frequency suitable for many applications, including the specialised requirements of welding systems.



SEMiX® has been developed for fast, solder-free mounting. The AC and DC terminals are located at opposite ends of the module and are all a standardised 17 mm height from the base, allowing a low-inductance design and a simplified bus structure. Its spring contacts allow the control PCB with driver etc. to be mounted directly onto the power module without any wiring or soldering.



These IGBT and rectifier modules open up new opportunities for creating flat and compact frequency inverter designs (AC/DC drives: 15kW – 110kW). Due to their identical case heights, the IGBT modules and input bridge rectifier modules can be directly connected using bus-bars instead of wires, saving 15 per cent volume compared to conventional rectifiers, reducing stray inductance and halving production time.



The diverse SEMiX® product line is available in four compatible case sizes of the 600, 1200 and 1700V IGBT modules from 75 to 600A and are available in half-bridge, six-pack and chopper topologies. The SEMiX® controlled and uncontrolled rectifier modules are offered in cases with an identical 17mm height. More options are therefore available for inverter designs, from standard drives and power supplies through to customised applications.



SEMIKRON also offers free support with Semisel, an online calculation and simulation tool at http://semisel.semikron.com/. Developers can use this tool to select the most suitable power semiconductor for a specific application.