Power switch driver boasts operates at extreme temperatures

Being able to properly drive normally-on (JFET, MESFET) as well as normally-off (MOSFET, JFET, BJT, SJT) transistors, the XTR26010 driver offers unique functional features allowing the increase of the application’s safety whilst increasing the maximum switching frequency. These features include isolated communication protocol between low-side and high-side drivers in order to prevent any possible cross-conduction in the application; independent monitoring of gate, drain and source terminals to detect any possible failure; on-chip Miller clamp with adjustable timing; possible pulsed drive for rapid turn-on of normally-off transistors; and on-chip soft shut-down switch. All these features in a single piece of silicon provide the highest level of integration for high-temperature drivers achievable today.

The implementation of IPM requires the minimization of parasitic inductances and capacitances between the driver and the power switch, as well as the minimization of the number of passive components to allow miniaturization as well as increased reliability. In this sense, the XTR26010 is the X-REL response to those requirements. The XTR26010 can be placed alongside the power switches thanks to its high temperature capability, while using a minimum number of passive components ensuring minimized bill-of-material.

As with any other X-REL Semiconductor product, the XTR26010 is able to reliably operate from -60°C to well above +230°C, with expected lifetime of about 5 years at +230°C. Being operational at high temperatures is mandatory in applications where the environment is at elevated temperature or where a power device makes the temperature increase inside the application casing. Additionally, all X-REL Semiconductor products can be used in applications running at lower temperatures (e.g. from 100°C to 200°C) where extended lifetime is expected or where failing is not an option. For example, the expected lifetime of X-REL Semiconductor parts in a driver application operating at Tj=150°C is over 35 years.

Gonzalo Picun, CTO at X-REL Semiconductor, emphasized: ”Since the birth of X-REL Semiconductor in 2011, we have been recognized by our customers as a company committed to bringing unprecedented innovation to the hi-temp, hi-rel semiconductors market. This has become one of X-REL’s signatures, and by releasing the XTR26010 we continue to grow this image. With the XTR26010 intelligent power driver we outpace our competitors and this has been noticeably appreciated by the market. Indeed, many customers are moving today to using our parts for performance, compactness, easiness of use and also pricing reasons.”

Isolated communication of the XTR26010 intelligent power driver with an application controller is made through the XTR40010 isolated transceiver. In applications where many transistors per phase are used, the drive strength of the XTR26010 (3 Amp per output) can be multiplied by using one or several XTR25010 power gate driver controlled by the XTR26010.

The XTR26010 is already available and can be immediately deployed on niche as well as on large-scale markets in high-reliability hermetic or plastic packages (XTR26011), as well as bare dies. For product demonstration, a compact half-bridge driver demo board with high-temperature capability will be available in March 2014.