Power modules combine packaging and chip technology to reduce losses
PCIM 2018: Fuji Electric highlights its PrimePACK power modules, for use in solar and wind applications. They have been enhanced with seventh generation X-Series chip technology for higher power density and reliability.
The M271 and M272 are available as 1200 and 1700V models. The M271 includes 1200V models with low switching loss (the 900A 2MB1900XXA120E-50 and the 1200A 2MBI1200XXE120E-50), soft turn off (the 900A 2MBI900XXA120P-50 and 1200A 2MBI1200XXE120P-50). The 1700V models are the 650A 2MBI650XXA170-50 and the 1200A 2MBI1200XXE170-50)
The M272 is available with soft turn off (the 1400A 2MBI1400XXB120P-50 and the 1800A 2MBI1800XXF120P-50) in the 1200V X-Series family and in the 1700V group, there is the 2MBI1000XXB170-50 1000A model, the 1400A 2MBI1400XXB170-50 and the 1800A 2MBI1800XXF170-50 model.
Dimensions for the M271 are 89 x 172mm and the M272 measures 89 x 250mm.
One of the characteristics of the power modules is the use of new solder material under the chips and direct copper bonding (DCB) to increase the thermal cycle capability. The combination of the X-Series chipset and thicker aluminium bondwires allows an increase in current density up to 1800A for both 1200 and 1700V versions.
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