Power
NEC announces HSON-8 package for PowerMOSFETs in automotive applications
NEC Electronics Europe today announced the availability of a new package variant, HSON-8, for low-voltage PowerMOSFETs in automotive applications. The 6.0 mm x 5.2 mm x 1.45 mm HSON-8 package has the same footprint as an SOP-8 package. Compared with a DPAK (TO-252), this reduces mounting space by half, while maintaining the excellent thermal and electrical properties of DPAK packages.
The Like all members of the NP Series, the new devices are qualified to AEC-Q101, support a channel temperature up to 175 °C and are fully RoHS-compliant thanks to tin-plated leads.
The new HSON-8 package addresses the growing demand for high-performance PowerMOSFETs with small dimensions for space-constrained applications in automotive engineering, such as ABS and fuel injection systems.