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NEC announces HSON-8 package for PowerMOSFETs in automotive applications

16th February 2009
ES Admin
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NEC Electronics Europe today announced the availability of a new package variant, HSON-8, for low-voltage PowerMOSFETs in automotive applications. The 6.0 mm x 5.2 mm x 1.45 mm HSON-8 package has the same footprint as an SOP-8 package. Compared with a DPAK (TO-252), this reduces mounting space by half, while maintaining the excellent thermal and electrical properties of DPAK packages.
The maximum current carrying capacity of the new package is 75 A. In conjunction with NEC Electronics’ UMOS-4 trench technology this means that an RDS(on) of 5.1 mΩ can be achieved for N-channel devices with VDSS = 40 V (NP75N04*UG) and of 6.2 mΩ for P-channel devices (NP75P03*DG) with VDSS = -30 V. N- and P-channel PowerMOSFETs with breakthrough voltages of -30 V, 40 V und 60 V are currently under development.

Like all members of the NP Series, the new devices are qualified to AEC-Q101, support a channel temperature up to 175 °C and are fully RoHS-compliant thanks to tin-plated leads.
The new HSON-8 package addresses the growing demand for high-performance PowerMOSFETs with small dimensions for space-constrained applications in automotive engineering, such as ABS and fuel injection systems.

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