Leadless MOSFET said to reduce footprint by 50%

5th March 2008

ES Admin

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Zetex Semiconductors has announced its first MOSFET to be packaged in the leadless 2mm x 2mm DFN package. With a PCB footprint 50% smaller than industry standard SOT23 packaged devices and an off-board height of just 0.85mm, the ZXMN2F34MA will benefit a range of space-starved switching and power management applications, such as external switches in buck/boost PoL converters, where PCB footprint, thermal performance and low threshold voltage are of prime importance.

The MOSFET is one of a series of six new low voltage - 20V and 30V - N-channel single and dual devices to be introduced by Zetex in a variety of different surface mount packages.

In spite of its miniature size, the 20V rated ZXMN2F34MA also offers a superior thermal performance to that of the much larger SOT23, with the DFN322 leadless package assuring a thermal resistance that is some 40% lower than comparable parts, enabling cooler running and improved power density. At typical gate source voltages of 4.5V and 2.5V, the MOSFET’s respective RDS(ON) values are just 60mΩ and 120mΩ. In addition, the low reverse recovery charge of these devices reduces switching loss and EMI problems, making them well suited for low voltage applications in notebook computers, mobile phones and general portable electronics where low in-line power loss is essential to increase recharge intervals.