Power
Intersil Announces Industry’s First 30A Fully-Encapsulated Power Module
Intersil Corporation today announced the ISL8225M, the industry’s first 30A fully-encapsulated power module. The ISL8225M features the industry’s highest power density and dramatically simplifies the design of high-performance board-mounted power solutions. The ISL8225M can deliver up to 100W output power from a small 17mm square PCB footprint. The two 15A outputs may be used independently or combined to deliver a single 30A output.
CurrDesigning a high-performance board-mounted power supply has never been simpler - only a few external components are needed to create a very dense and reliable power solution. And the QFN package with external leads permits easy probing and visual solder inspection.
Features and Benefits
-Dual 15A or single 30A output from a 17mm square PCB footprint
-4.5V to 20V input voltage range
-0.6V to 6V output voltage range
-Up to six modules may be paralleled to support 180A output current
-Full power operation without heat sinks or fans
-Exposed QFN package leads permit easy probing and visual solder inspection
Pricing and Availability
The ISL8225M is currently available in a 17mm x 17mm QFN package with prices starting at $48.85 each in 500-unit quantities.
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