IR's µIPM power modules offer 60% smaller footprint

Tthe IRSM808-105MH and IRSM807-105MH half-bridge power modules provide a highly compact heatsink-free solution for applications such as compressor drives for refrigeration, pumps for heating and water circulation, air-conditioning fans, dishwashers, and automation systems. Coming from IR’s patent pending µIPM product family, the devices are available in an ultra-compact 8x9x0.9mm PQFN package. Alberto Guerra, Vice President, Strategic Market Development, IR’s Energy Saving Products Business Unit commented on the release by saying; “The IRSM808-105MH and IRSM807-105MH half-bridge µIPM™ power modules provide designers with even greater scalability, in addition to offering up to a 60 percent smaller footprint compared to existing leading solutions and delivering advantages in output current capability and system efficiency cost-effectively.”

Specifications

** RMS, Fc=16kHz, 2-phase PWM, ∆T_CA=70°C, T_A ≈ 25°C

IR’s patent pending µIPM™ product family offers a scalable power solution with common pin-out and package size. Featuring the most rugged and efficient high-voltage FredFET MOSFET switches optimized for variable frequency drives and IR’s most advanced high-voltage driver ICs, the µIPM product family offers DC current ratings ranging from 2A to 10A and voltages of 250V and 500V. The new approach pioneered by IR for this market segment utilizes PCB copper traces to dissipate heat from the module, providing cost savings through a smaller package design and eliminating the need for an external heat sink. By using standard packaging QFN technology, assembly is simplified by eliminating through-hole second pass assembly and improving thermal performance compared to traditional dual-in-line module solutions.