Integrated power modules offered in alternative DIP packaging

27th May 2014

Mick Elliott

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Datasheet

Surface mount devices are not the answer for every customer and International Rectifier recognised this issue and launched the µIPM-DIP family of highly integrated, compact Integrated Power Modules (IPM). The devices were originally launched, and are still available in a compact, surface mount package.

“There is a customer demand for this bigger footprint, the advantage being its flexibility” argues Andrea Gorgerino, Director of IGBT Applications Engineering for Energy Saving Products at International Rectifier.

The devices target low power motor drive applications including fans, pumps, air purifiers and refrigerator compressor drives, some typically used in domestic appliances including washing machines.

So the new version of these devices comes in a compact 12 x 29mm SOP/DIP package, and offers a cost effective power solution by leveraging industry standard footprints and processes compatible with various PCB substrates.

The family of 32 new devices features rugged and efficient high-voltage FredFET MOSFETs specifically optimised for variable frequency drives with voltage ratings of 250V or 500V. These devices are paired with IR’s most advanced high-voltage driver IC tuned to achieve optimal balance between EMI and switching losses.

The µIPM-DIP family offers DC current ratings ranging up to 4.6A to drive motors up to 150W without a heatsink and are available in both through-hole and surface mount package options.

The new µIPM-DIP modules are an addition to IR’s iMotion design platform which integrates digital, analog and power technologies together in a flexible, mixed signal chipset to simplify motor control designs and bring energy-efficient, cost-effective solutions to market faster.