Smallest Footprint Surface Mount Package For 1.2KV To 1.8KV Power Semiconductors

“The market demands smaller footprint solutions for 1.2KV to 1.8KV power semiconductors. The main reason for this is the higher power demands which are realized by higher voltages instead of higher current. By using a higher voltage the conduction losses in copper wires are less for power control circuits; therefore, thinner copper conductors or traces on PCB circuits can be used. These SMDs improve energy efficiency, reduce cost, reduce size and reduce weight when used in power electronics,” commented Mr. Jeroen van Zeeland, head of marketing at IXYS Germany.

Until now there was no such solution for applications higher than 1.2KV. The new IXYS D2-Pak and D3-Pak designs now offer the standard footprint, but with compliance to the high voltage ‘creepage’ specifications.

For D3-Pak the creepage distance between the terminal to the copper of the backside is greater than or equal to 5.80 mm. The same value for the D2-Pak is greater than or equal to 4.70 mm. This enables the use of 1.2KV D3-Pak in pollution degree 2 industrial designs. In addition to industrial power control applications, these devices target other 1.2KV to 1.8KV power supply, UPS, renewable energy, motor drives and medical applications.

The following products are already available:
- CMA30E1600PZ (D2-PakHV, single SCR with 30A and 1600V)
- DMA10P1600PZ (D2-PakHV; phase-leg for diode bridges with 10A and 1600V)
- CMA50E1600TZ (D3-PakHV, single SCR with 50A and 1600V)
- DSP45-16TZ (D3-PakHV; phase-leg for diode bridges with 45A and 1600V)
- Standard delivery mode for D2-Pak is Tape & Reel and tube for D3-Pak (T&R on request)