Connected car power package gets shrunk

The LFPAK33 is optimised for high density automotive applications with a footprint that NXP claim is more than 80% smaller than the most popular solution currently in use. The significantly smaller low resistance package was created in response to growing industry pressure to reduce the size of modules in the car while continuing to improve energy efficiency and reliability.

“As more subsystems are crammed into the connected vehicle, the need for rugged, compact power systems are becoming ever greater,” said Richard Ogden, Product Marketing Manager, at NXP. “The introduction of the LFPAK33 sets the benchmark for automotive MOSFET performance in a compact package. This extension of the LFPAK portfolio provides designers with more product choices than anything on the market today.”

The NXP LFPAK33 package uses a copper clip design to reduce the package resistance and inductance which in turn reduces the RDS(on) and switching losses of the MOSFET. The full NXP range of LFPAKs allows designers the broadest range of devices in this compact footprint.

Key Benefits:

• Ultra-compact footprint - 10.9 mm².
• Thermal Performance - no wires, no glue, 175^oC T_¬j max.
• Electrical performance - low package resistance and inductance, up to 70A max rating.
• Extensive portfolio - product range between 30-100V, as low as 6.3mΩ.

Target Applications

• Next generation engine management
• Chassis and safety
• LED Lighting
• Relay replacement
• C2X systems
• Radar
• Infotainment systems
• Navigation systems
• ADAS