C-MAC MicroTechnology announces further development of high temperature DC-DC converters

The extended product range will provide output voltages in the range of 1.2V up to 90% of VIN at 2A and up to 50% reduction in physical size. Efficiencies of more than 90% above 200°C confirm the leading class position of the product family. Single, dual and triple output voltage modules as well as higher current versions will be available over the coming months.

These new products will again feature C-MAC’s high temperature microcircuit integration technology which has been demonstrated to provide the highest level of reliability for extended temperature applications. The high aspect ratio package design will continue to focus on high reliability, harsh environment applications such as Oil and Gas deep-well drilling and engine sensing, control and management in the Aerospace and Defence markets. The flexibility of C-MAC’s design and manufacturing team will provide the optimum packaging solutions for the module while allowing custom configurations to be offered.

Paul Hill, General Manager, of C-MAC MicroTechnology said: “The progression along our high temperature DC-DC roadmap demonstrates C-MAC’s commitment to continuous product and technology development. I’m delighted with the success of our high temperature product and this announcement shows our complete commitment to high temperature electronics technology and will maintain our position for the foreseeable future as the premier supplier of electronics for extreme environments.”

Tony Denayer, CEO of CISSOID said: “Our Vesuvio™ technology for DC-DC converters provides the best-in-class efficiency of power conversion at extreme temperatures. Based on the Magma-Hyperion chipset, Vesuvio is the ideal answer to environmental constraints in Aeronautics and Oil&Gas applications. Also, its robustness at high junction temperature enables considerable space and weight savings in converters and chargers for automobile and industrial applications. We are excited with our continued cooperation with C-MAC MicroTechnology whose proven integration and assembly technologies perfectly complements our chipsets.”