Automotive power MOSFETs designed for space efficiency

The LFPAK56D copper clip gull wing package technology offers board level reliability in thermally demanding applications such as engine management, transmission control and ABS systems.

The LFPAK56D offers two isolated MOSFETs in one Power-SO8 package. The LFPAK56D occupies 77% less PCB space than two DPAK’s or 50% less space than a single Power-SO8 device, offering significant savings in space, weight and cost. The release of the new 80V technology extends Nexperia’s LFPAK family of gull wing, copper clip devices in LFPAK56, LFPAK56D and LFPAK33, offering customers the flexibility to optimise their design for performance, flexibility and size.

Richard Ogden, Nexperia’s product marketing for Automotive MOSFETs, commented: “Engine management is a thermally demanding application space, with PCB modules exposed to harsh temperature cycles. These temperature cycles cause the PCB to expand and contract resulting in significant stress on the PCB solder joints. Due to the design of the LFPAK56D these stresses on the PCB solder joints are absorbed resulting in excellent board level reliability. By combining innovative internal and external package features the LFPAK56D is the ideal MOSFET for engine management systems."

LFPAK56D is typically used in applications such as solenoid control, motor control and DC/DC power conversion, with the 80V portfolio specifically aimed at engine management and LED lighting applications.

The full portfolio of dual power-SO8MOSFETs in LFPAK56D is available now.