Power

Power Integrations has enhanced its hardware-software bundle for brushless DC motors (BLDC) with the introduction of BridgeSwitch-2.

New families of silicon carbide (SiC) MOSFETs and Schottky Barrier Diodes (SBDs) in TSPAK packaging are being premiered by WeEn Semiconductors at PCIM Europe in Nuremberg (June 11-13).

Magnachip Mixed-Signal (MMS) has announced the release of a multi-functional Power Management Integrated Circuit (PMIC) and a multi-channel level shifter to regulate various voltages and signals within display panels in IT devices.

A new 16/24-channel driver IC for automotive LED applications is being demonstrated by NOVOSENSE Microelectronics at PCIM Europe 2024 in Nuremberg (June11-13).

SemiQ has added 1700V SiC Schottky discrete diodes and dual diode packs to its QSiC product line.

Cambridge GaN Devices (CGD) has launched its lowest ever on-resistance (RDS(on)) parts.

At PCIM 2024, ROHM unveiled its new SiC product offerings as well as outlined its vision for the future. Leading the conversation was Dr. Kazuhide Ino, Managing Executive Officer & Head of Power Device Business at ROHM.

ROHM has developed four models as part of the TRCDRIVE pack series with 2-in-1 SiC moulded modules (two 750V-rated: BSTxxxD08P4A1x4, and two 1,200V-rated: BSTxxxD12P4A1x1) optimised for electric vehicle (xEV) traction inverters.

Qorvo announced the industry's first 4 milliohm silicon carbide (SiC) junction field-effect transistor (JFET) in a TOLL package.

The TMS320F2838x (F2838x) is a member of the C2000 real-time microcontroller family of scalable, ultra-low latency devices designed for efficiency in power electronics, including but not limited to: high power density, high switching frequencies, and supporting the use of GaN and SiC technologies.