Power

Navitas Semiconductor has extended its new portfolio of Gen-3 ‘Fast’ (G3F) 650 V SiC MOSFETs into a thermally-enhanced, rugged, high-speed, surface-mount TOLL (Transistor Outline Leadless) package designed for demanding, high-power, high-reliability applications.

Infineon has expanded its GaN portfolio with the CoolGaN Drive product family of integrated single switches and half-bridges with integrated drivers.

A global team of TIers persisted through challenges to develop the new MagPack packaging technology for power modules, a breakthrough that will help advance the future of power design

Electronic Specifier takes a look at the top 5 power products to have been released in July 2024.

TTI Europe is now stocking Vishay’s fourth-generation 600V SiHR080N60E E Series power MOSFETs. Available in the new PowerPAK 8 x 8LR package, the device provides high efficiency and power density for telecom, industrial, and computing applications.

Magnachip has announced the release of its 8th-generation MXT LV MOSFET for smartphone battery protection circuits.

The TMCS1123EVM evaluation module (EVM) is intended to facilitate rapid, convenient use of the TMCS1123, an isolated Hall-effect precision current sense monitor using an internal ratiometric reference.

Gallium Nitride (GaN) is presently in a position that will see it, alongside Silicon Carbide (SiC), revolutionise power supply design as a whole, moving away from traditional purely silicon (Si)-based analogue designs. So how is this design revolution happening, and where is GaN having the most impact?

Magnachip has announced the completion of the development of its 1200V 75A Insulated Gate Bipolar Transistor (IGBT) in a TO-247PLUS package, designed for solar inverters. The Company plans to start mass production in October this year.

The ISOM871x devices are single-channel opto-emulators with diode-emulator inputs and digital outputs. The devices are pin-compatible and drop-in replaceable for many traditional optocouplers, allowing enhancement to industry-standard packages with no PCB redesign.