Passives
Tyco - Bi-directional, Silicon-based Esd Protection Devices Help Reduce Assembly Challenges
Tyco Electronics (TE) has announced the expansion of its silicon ESD (electrostatic discharge) protection product portfolio with the introduction of 0201- and 0402-size devices that are easier to install and rework than traditional semiconductor-packaged ESD devices. The ChipSESD package combines the advantages of an active silicon device with a traditional Surface-Mount Technology (SMT) passive packaging configuration.
The The ChipSESD devices feature a surge rating of 2A under 8x20µs surge and an ESD rating of 10kV contact discharge. The devices’ low-leakage current (1.0µA max) reduces power consumption and a fast response time (<1ns) helps equipment to pass IEC61000-4-2, level 4 testing. Their input capacitance of 4.0pF (0201 package) and 4.5pF (0402 package) makes them suitable for helping to protect:
* Cellular phones and portable electronics
* Digital cameras and camcorders
* Computer I/O ports
* Keypads, low voltage DC lines, speakers, headphones and microphones
“The ongoing trend toward discrete component miniaturization often presents designers with difficult and time-consuming engineering prototyping and rework challenges as well as manufacturing process control issues,” stated Nicole Palma, Product Manager. “Tyco Electronics’ new ChipSESD devices help mitigate assembly and manufacturing challenges and speed time to market. They also demonstrate Tyco Electronics’ commitment to providing a broad portfolio of smaller scale, higher-performance SMT solutions for the consumer electronics industry.”