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TTI, Inc. first European distributor to stock Semelab’s DLCC Diode Leadless Chip Carrier

17th August 2010

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TTI, Inc. has become the first Pan-European distributor to stock Semelab’s recently-introduced DLCC family of hermetic ceramic leadless chip carrier packages for diodes which has been designed for all high reliability applications including space, aerospace, high temperature and military programs. The DLCC package design takes full advantage of the proven high reliability pedigree of the HTCC surface mount packaging technology, which is easily integrated for automated assembly. Semelab has taken the existing standards for ceramic surface mount package manufacture and added additional design features to enhance thermal performance, to present a competitive alternative for high reliability applications.

The physical dimensions for the DLCC ceramic packages are designed to fully utilise the recommended solder footprint for the popular MELF packages, and are therefore a drop in replacement for existing board design. Thermal vias improve the heat transfer to the solder pads reducing the diode junction temperature and increasing operating lifetime; options are also available to allow the lid to be connected to the Anode or Cathode. Connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; as described in the Space Weather link on Semelab’s web site. www.semelab.co.uk/mil/DLCC

Comments Ros Kruger, Industry Marketing Director, Europe – Military, Aero and Space for TTI, Inc.: “Semelab has 30 years experience in the manufacture of semiconductor devices for high reliability applications. Designed as a cost-effective solution and manufactured in accordance with MIL-19500 and ESA specifications, the new DLCC packages are perfectly suited to meet the challenges of harsh environments.“