Passives
Syfer capacitors now offer better capacitance vs package size combinations
Innovative developments in ceramics materials and manufacturing technology have led to significant extensions in the range of high voltage multilayer, surface mount chip capacitors, available from Syfer Technology. The ability to reduce package size or increase capacitance range in the same package size will prove critical to meeting today’s tight design constraints.
AlreFor those seeking higher capacitance without increasing package size, the 1206 1.5kV capacitor, for example, has now been increased to an impressive 10nF, up from 2.7nF. Many devices offer double the capacitance of earlier versions. The 1812 1kV part has been extended from 56nF to 100nF.
If physical space is critical, then Syfer’s latest devices offer the possibility of choosing a smaller case size, resulting in not only reduced board space requirements, but lower cost too. For example a 1kV, 1nF capacitor, previously offered in a 1206 package, is now available in the 0805 case size, and a 1kV 10nF part, previously in a 1812 footprint, is now offered in a 1206 package.
The recent extensions give engineers a broader choice of high voltage devices to optimise their designs for performance and package size, while ensuring they are cost effective to meet tight budgetary constraints.
For added reliability, Syfer offers its FlexiCap polymer termination option, as an alternative to a standard plated termination. FlexiCap accommodates a greater degree of board flex than a conventional termination. Devices meet RoHS standards with lead-free terminations. However, for exempt applications, versions with tin-lead contacts can be supplied. To meet the most stringent quality standards, Syfer can also offer additional testing services.