Surface-mount capacitors handle high ripple currents

KONNEKT technology uses an innovative transient liquid phase sintering (TLPS) material to create a surface-mount multi-chip solution for high-density packaging.

By utilising KEMET's robust and proprietary C0G base metal electrode (BME) dielectric system, these capacitors are well-suited for power converters, inverters, snubbers, and resonators where high efficiency is a primary concern.

KONNEKT technology enables a low-loss, low-inductance package capable of handling extremely high ripple currents with no change in capacitance versus DC voltage and negligible change in capacitance versus temperature.

With an operating temperature range up to +150°C, these capacitors can be mounted close to fast-switching semiconductors in high-power density applications that require minimal cooling. KC-LINK with KONNEKT technology also exhibits high mechanical robustness compared to other dielectric technologies, allowing the capacitor to be mounted without the use of metal frames.

These capacitors can also be mounted in a low-loss orientation to further increase power handling capability. The low-loss orientation lowers effective series resistance (ESR) and effective series inductance (ESL), which increases ripple current handling capability.