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Laird Technologies Expands EMI Metals Product Line with SMD Grounding Contacts

8th January 2013

ES Admin

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Laird today announced it has expanded its EMI Metals product line with SMD Grounding Contacts. The EMI product line is a core piece of Laird’s value proposition to deliver solutions for today’s smaller, more advanced electronics. As part of Laird Performance Materials (LPM), these products provide vital protection for a wide range of high-performance electronic devices.

Specifically designed for on-board grounding solutions, Laird Technologies offers more than 50 standard SMD Grounding Contacts to reduce and control noise in electronic applications. With different shapes and heights these new SMD contacts are ideal for situations where large gaps have to be bridged and low compression force is required.

“Today, customers of all industries value the high flexibility and advantage of receiving comprehensive business solutions from one source,” said Manuel Klesinski, Laird Technologies Product Manager. “By offering Board Level Shields, Precision Stamped Metals, Connector Gaskets and now SMD Grounding Contacts we are able to offer the best solution for Printed Circuit Boards.”

The SMD Grounding Contacts are made from Beryllium Copper and are RoHs compliant, with excellent physical, mechanical and electrical properties. Standard finish for these contacts is Gold over Nickel, with other options available. They will be packed and delivered in Tape & Reel for automated placement.