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TE Circuit Protection introduces industry’s lowest capacitance Silicon ESD Devices for high-data-rate applications
TE Circuit Protection announces a family of eight new single- and multi-channel silicon ESD (SESD) protection devices offering the lowest capacitance (bi-directional: 0.10pF typical; uni-directional: 0.20pF typical), highest ESD protection (20kV air and contact discharge) and smallest size (multi-channel: smallest flow-through form-factor and 0.31mm height) packages available on the market.
The The single- and multi-channel SESD devices also feature an industry-leading 20kV contact and air discharge rating, exceeding IEC61000-4-2’s 8kV industry standard. In the event of a high voltage ESD strike, this high kV rating helps minimize the risk of the ESD device failing short and permanently disabling the port, or open, exposing the downstream chipset to damage caused by another ESD strike. This capability helps reduce customer complaints and warranty repair costs.
“ESD protection devices add capacitance on data lines, which in turn can cause signal integrity issues that hamper a product’s performance and interoperability. Today’s high-speed ports need the lowest-capacitance ESD devices available to provide the highest degree of protection while having minimal effect on signal transmission,” said Patrick Hibbs, Global Strategic Marketing and ESD Business Manager for TE Circuit Protection. “Our new SESD devices offer capacitance that is up to 92% lower than competing ‘ultra-low-capacitance’ solutions. This means our SESD devices are ready for Thunderbolt applications today. And even though the 4K ultra-high-definition (UHD) and quad high-definition (QHD) TV markets are still emerging, our SESD devices are ready for these applications as well.”
Consumer electronics are constantly shrinking and TE Circuit Protection’s SESD devices offer size advantages in the ongoing trend for miniaturization. The single-channel devices are available in 0201-sized XDFN small footprint (0.6mm x 0.3mm x 0.31mm) and 0402-sized XDFN (1.0mm x 0.6mm x 0.38mm) packages. The multi-channel SESD arrays (two-, four- and six-channel options) feature a package height as low as 0.31mm– resulting in up to a 50% lower profile than comparable devices. The SESD devices’ lower profile allows for placement closer to the edge of the PCB, or in-between boards and connectors, facilitating design flexibility.
Additionally, one miniature four-channel SESD array can be used in a smaller board area than four 0201 devices, resulting in board space, assembly cost and device cost savings. As the smallest 4- and 6-channel flow-through arrays on the market, these devices also ease routing when used with applications employing miniature-size connectors, such as HDMI Type-D, mini DisplayPort, Thunderbolt and USB 3.0 Micro-B.
Product Family Description:
• • SESD0201X1BN-0010-098: 1-channel, bi-di, 0.10pF cap., 20kV rating, 0201 package
• • SESD0402X1BN-0010-098: 1-channel, bi-di, 0.10pF cap., 20kV rating, 0402 package
• • SESD0201X1UN-0020-090: 1-channel, uni-di, 0.20pF cap., 20kV rating, 0201 package
• • SESD0402X1UN-0020-090: 1-channel, uni-di, 0.20pF cap., 20kV rating, 0402 package
• • SESD0402Q2UG-0020-090: 2-channel, uni-di, 0.20pF cap., 20kV rating, 0402 3L package
• • SESD0802Q4UG-0020-090: 4-channel, uni-di, 0.20pF cap., 20kV rating, miniature array package
• • SESD1004Q4UG-0020-090: 4-channel, uni-di, 0.20pF cap., 20kV rating, standard array package
• • SESD1103Q6UG-0020-090: 6-channel, uni-di, 0.20pF cap., 20kV rating, miniature array package
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Price: Unit pricing starting at $0.16 for 10,000 unit quantities
Availability: Available now