Passives

Riedon power film resistors offer high-frequency performance

8th August 2013
Nat Bowers
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Riedon has today announced a cost-effective power resistor design achieving superior performance in high-frequency applications and high-speed pulse circuits. The various TO-style resistors within Riedon’s PF family are non-inductive and use an advanced power film formed on a heat-conducting alumina substrate that is metalized and soldered to a heat-dissipating copper plate tab.

This process offers devices featuring excellent thermal resistance in small-size, thin-profile TO-style packages for high-density applications.

Phil Ebbert, Riedon’s VP of Engineering, commented: “All our TO-style thin-film resistors combine superior performance with the full power-dissipation capabilities these packages offer. In addition, the low-inductance design makes these parts ideal for high frequency applications, such as wireless communications, or in systems that need to withstand short-duration, high-energy pulses, for example, medical equipment.”

Available with power ratings from a few Watts up to 600 Watts, the resistors come in both through-hole and surface mounting packages. The PF1260 series provides resistances in the range 0.01Ω to 51kΩ, tolerances from ±1%, a temperature coefficient from ±50ppm, and up to 20W dissipation (with a heatsink) in an epoxy-molded TO-126 leaded package. The PF2200 and PF2470 series offer similar specifications but with increased dissipation up to 50W and 140W in leaded TO-220 and TO-247 packages, respectively.

Designed for ultimate power dissipation, the PF2270 series handles up to 300W in a screw-terminal TO227 style package, when attached to an appropriate heatsink and subject to temperature derating. The last of the new introductions, the PFS35 series provides a solution for surface mounting, using a TO-263 housing (D-Pak) to provide 35W dissipation when used with a heatsink or 2W with a simple solder pad.

Riedon’s full range of TO-style power resistors are available from Digi-Key.

This process offers devices featuring excellent thermal resistance in small-size, thin-profile TO-style packages for high-density applications.

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