Passives

Polar Instrument releases new fault locator

5th August 2024
Caitlin Gittins
0

The new GRS200 fault locator from Polar Instruments employs well-established passive analogue signature analysis to compare a faultless assembly with the board under test. 

This technique swiftly identifies common faults in electronics production, servicing, and repairs without requiring extensive circuit knowledge.

"By using the GRS200, missing or reversed components, incorrect component values or component types, counterfeit components as well as short circuits or opens can be recognised very easily," said Hermann Reischer, Managing Director of Polar Instruments.

The system consists of analogue signature hardware and powerful software with LIVE signature analysis, program mode and CAD data display. In addition, circuit diagrams, assembly photos, repair reports and an optional digital multimeter may be integrated. For detailed analysis, the system imports more than 20 different formats CAD data, including GenCAD, Hyperlynx, IPC-2581 and ODB++. Furthermore, circuit networks can be graphically highlighted and the associated components displayed.

The nodal impedance test is conducted on an unpowered module, where a current-limited AC voltage signal generates an impedance signature by measuring voltage and current. The GRS200 system compares the signatures of the defective module with a stored good sample and indicates any significant deviations above a defined threshold. Alternatively, an external multimeter can be integrated into the test process. This enables the assignment of voltage and resistance values, frequencies, and temperatures to specific test points in the CAD layout. It is also possible to locate short circuits on power supply rails and bus lines. An integrated short-circuit locator, in conjunction with the external multimeter, traces networks based on CAD data using a highly sensitive four-wire resistance measurement and tone control. This allows the physical location of a short circuit to be pinpointed to within a few millimetres.

Within the test programme, test points are mapped to circuit networks in the CAD file, and their analogue signatures are saved for later comparison. If no CAD data is available, test programmes can be created manually by defining the IC package style and the number of pins.

All test results are documented for traceability. Each assembly's results are recorded in a repair report, providing valuable repair history information. An optional USB camera can be used to take photos of an assembly, which can then be saved as photo documentation in the test programme.

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