Nexperia offers automotive planar Schottky diodes in space-saving CFP3-HP packaging

This assortment encompasses 11 industrial-grade and 11 AEC-Q101 certified products, catering to the increasing move among manufacturers towards adopting smaller CFP-packaged devices over traditional SMx-type packaging, particularly in the automotive sector. These diodes are designed for various applications including DC-DC conversion, freewheeling, reverse polarity protection, and OR-ing functions.

The portfolio offers a wide range of design options, with reverse voltages VR(max) spanning from 30 to 100V and forward currents IF(average) from 1 to 3A. The CFP3-HP's distinctive exposed heatsink feature allows for unparalleled heat dissipation (Ptot) efficiency in a small package size (3.7 x 1.8 x 0.9mm).

"As the industry transitions to smaller packages like CFP, Nexperia is committed to actively contributing to this shift, reinforcing our dedication to packaging innovation," says Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia. "With substantial investments in capacity expansion, we are poised to meet the increasing demand for CFP-packaged products, surpassing market expectations for the next three years. These diodes mark the latest additions to our extensive portfolio of over 270 CFP-packaged products."

Leveraging Nexperia's proprietary copper clip design, the CFP packaging meets the rigorous requirements of efficient, space-saving designs. The versatility of CFP packaging, now encompassing Nexperia’s Schottky and recovery rectifiers, as well as potentially extending to bipolar transistors, underscores the company's leadership in packaging innovation. This expansion further cements Nexperia’s role as a key player in the semiconductor industry, offering an unmatched range of device options within a reliable supply chain.