TDK Announce Miniaturized Multilayer Chip Beads With Excellent Noise Attenuation

The MMZ0603-E series is currently available in two high-impedance versions, one rated for 600 Ω and the other for 1000 Ω at 100 MHz. Both types offer even higher impedance values at 1 GHz of 1000 Ω and 1800 Ω, respectively.

Thanks to its very good impedance values, a single component can cover a very wide frequency range, ensuring highly efficient noise attenuation. The MMZ0603-E multilayer chip bead is therefore very well suited for eliminating noise in compact mobile devices, especially in smartphones that must operate with multiple communication frequency bands.

The significant advance in the miniaturization of chip beads was made possible by TDK’s Gigaspira® production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals. With the new high-performance MMZ0603-E series in case size 0603, which is fast becoming the dominant form factor for passive components in smartphones, TDK is meeting these market needs. Mass production started in February 2013.

Main Applications

-Mobile devices such as smartphones, tablet PCs, audio players, and digital cameras
-Compact devices with wireless connectivity such as Bluetooth, WLAN, GPS, etc.
-Data storage devices such as HDDs

Main Features And Benefits

-Miniature dimensions of 0.6 x 0.3 x 0.3 mm³ result in significant space savings on the PCB
-High impedance over wide frequency range in a single component