Passives
Expanded PowerStrip series from Samtec now available through TTI, Inc.
Recently introduced by Samtec and now available through TTI, Inc., the world’s leading authorized specialist distributor of passive, connector and electromechanical components, the expanded range of PowerStrip high power-to-board interconnect systems combines high current carrying capacity with signal routing options for rugged applications.
Now Suitable for parallel board spacings of 19 mm and for perpendicular and coplanar board interface applications, polarized, through-hole PowerStrip connectors are RoHS-compliant and suitable for lead-free processing. Right-angle versions benefit from screw-down features for added ruggedness.
Samtec offers a broad line of power and combination power/signal interfaces for board-to-board and wire-to-board applications.