Parker release new generation of dispensable Thermal Gels

The company claim the product, offering heat-transfer performance of 4.0W/m-K thermal conductivity, will have users of THERM-A-GAP GEL 40NS discover a thermally reliability material in an ultra-low compression force package: it deforms easily under assembly pressure, minimising stress on components, solder joints and leads. The fully cured and dispensable product requires no mixing and maintains the traditional advantages of Parker Chomerics’ line of thermal gels, providing integration into high-volume, automated assembly applications, as well as rework and field repair situations.

The THERM-A-GAP GEL 40NS is designed to conform to rough surface irregularities, displaces air gaps and takes up manufacturing tolerances on heat-generating components. The product provides very low thermal impedance at bond lines as thin as 0.15mm.

“The consumer electronics, automotive and telecommunications industries have spent years waiting for a high-performance, reliable, non-silicone solution that fits into the portfolio of dispensable and cost-effective thermal interface materials,” says Ben Nudelman, Global Market Manager, Chomerics Division. “We’re beyond excited to launch a product that finally meets these demands and has a combination of physical and thermal properties that is unmatched in the industry today.”

Requiring no secondary curing, THERM-A-GAP™ GEL 40NS is a solution for applications that must reduce the risks associated with silicone oil migration or contamination, or for devices manufactured in silicone-free facilities.

“The global electronic assembly and manufacturing ecosystem continues to adopt strict material controls,” explains Nudelman. “This, along with advances in optical data transmission, electric vehicle (EV) technology and state-of-the-art sensors, leads to nearly limitless applications for our newest thermal material.”