Thermal imaging camera helps cut test times

26th July 2017

Mick Elliott

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Datasheet

Designed for quick temperature checks on printed circuit boards and other small electronics the FLIR ETS320 Thermal Imaging camera is available at distributor Farnell element14. It can be used in the laboratory, for accurate quality assurance and factory acceptance testing. Heat can be an important factor in understanding how a system is functioning and the camera provides non-contact thermal measurement through a combination of a high sensitively infrared camera with an integrated stand for hands-free measurement.

Benefits include reduced test times. The camera can quickly identify hot spots, thermal gradients, and potential points of failure, detecting temperature shifts as small as (<0.06c) and quantifying heat generation up to 250^oC.

Improved product design means the camera has 78,000 points of non-contact measurement enabling users to identify where and when to add fans and heat syncs to ensure products operate within specified parameters for maximum lifetime.

A temperature measurement accuracy of ±3°C makes the camera ideal for quality assurance and factory acceptance testing.

The camera is designed for hands-free use in the lab with a micro-scope style stand that is easy to set up and suited to testing small electronics.

It is battery operating removing the inconvenience of wires and has simplified features offering complete measurement and analysis on the camera, alongside ease of use.

It helps accelerate prototyping and reduces product development cycles.

Key features include a 320 x 240 pixel IR detector non non-contact measurement, crisp 3in. LCD display providing immediate thermal feedback, 45° field of view, thermal sensitivity (NEtD) of 0.06°C, temperature measurement accuracy of ±3°C and a wide temperature range of up to 250°C, and hands free-battery operated measurement.