PAM-4 linear transimpedance amplifiers enter production

5th March 2019

Mick Elliott

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Production versions of its four-channel (4 x 100G) 56/106 Gbit PAM-4 linear transimpedance amplifiers (TIAs) which are optimised for use in 400G optical modules targeting Cloud Data Centre applications have been announced by MACOM Technology Solutions.

The MATA-03820 and the MATA-03819 are available in flip chip and wire bonding packaging options, respectively, for fast, flexible deployment in single-lambda 400G-FR4 and DR4 format QSFP-DD and OSFP optical modules.

Delivering low noise performance less than 1.5uA RMS typical and supporting bandwidth up to 35GHz, MACOM’s MATA-03820 and MATA-03819 TIA family supports high throughput optical data links in a very low power profile, optimal for use in high density optical Data Centre interconnects.

Features include RSSI for photo-alignment and power monitoring, and I2C management interface for control of bandwidth, output amplitude, peaking, loss of signal (LOS), gain and other key parameters.

“Molex is excited to collaborate with MACOM. Leveraging MACOM’s technical support along with its broad portfolio of TIAs we are able to ensure the availability of industry leading 400G optical modules,” said Adit Narasimha, Vice President and General Manager, Molex Optoelectronics. “The low noise performance of MACOM’s TIA along with its flexible programmability, enable delivery of industry leading low bit error performance when implemented with a DSP for 400G modules.”

“In the rapid evolution to single fibre 100G and parallel fibre 200G and 400G connectivity, we believe that MACOM has again affirmed its leadership position in delivering the high-performance, power-efficient optical components needed to maximise bandwidth density in the Cloud Data Centre,” said Marek Tlalka, Senior Director of Marketing, High-Performance Analog, MACOM. “MACOM’s MATA-03820 and MATA-03819 TIA family, complemented by a comprehensive portfolio of seamlessly-interoperable MACOM components, is helping our customers accelerate this transition.”

For customers targeting APD applications, MACOM is now sampling its MATA-03921 (flip chip) and MATA-03919 (wire bonded) TIAs.

The company is hosting demonstrations of its expanded PAM-4 chipset for 100G, 200G and 400G applications at OFC 2019 in San Diego (March 5-7), featuring the MATA-03820 and MATA-03819 TIAs in customer module implementations and a live 200G/400G ROSA demonstration.