Optoelectronics
OmniVision Launches First OmniBSI-2 Image Sensor
OmniVision Technologies introduced its most advanced 8-megapixel image sensor to date, and the first to use OmniVision’s second generation OmniBSI-2 pixel architecture. Implementing the latest developments in backside illumination (BSI) pixel technology, the OV8830 combines low power consumption, small die size and best-in-class pixel performance with advanced image processing features.
ThisAs compared to OmniBSI, OmniBSI-2 technology also provides the basis for a larger collection region in the photodiode. The results include increased sensitivity, improved image quality and enhanced color reproduction, leading to more responsive overall sensor performance. The OmniBSI-2 pixel architecture offers many performance improvements over OmniBSI technology as applied to OmniVision’s 8-megapixel sensor product portfolio. These advances include a 20 percent improvement in peak quantum efficiency in all color channels, a 35 percent improvement in low-light sensitivity and a 45 percent increase in full-well capacity. “The OV8830 sets a new performance standard in the popular 8-megapixel camera segment of the highly video-centric smart phone market,” said Vinoo Margasahayam, product marketing manager for OmniVision. “OmniBSI-2 technology allows us to offer an 8-megapixel sensor with best-in-class sensitivity and image quality, optimized power consumption and advanced features in a small footprint – qualities that we believe make it ideal for the next generation of smart phones.” The 1/3.2-inch OV8830 image sensor offers a range of advanced features including high frame rates, an integrated scaler, and 2 x 2 binning functionality.
The scaler enables electronic image stabilization, while maintaining full field of view in 1080p/30 HD video mode. The sensor’s binning functionality with postbinning re-sampling filter minimizes spatial artifacts and removes image artifacts around edges, delivering clean, crisp color images for best-in-class 720p HD video. The OV8830 fits into the industry standard module size of 8.5 x 8.5 x 6 mm and is now available for sampling. Mass production is expected to start in the second half of 2011.