Laser annealing system designed to save semiconductor market

Veeco’s new, SEMI-compliant facility serves as the company’s centre of excellence for the development and production of laser annealing and advanced packaging lithography systems for semiconductor applications.

Comments Bill Miller, Veeco’s Chief Executive Officer: “Aligned with the company’s growth strategy, this new manufacturing space enables Veeco to serve the world’s leading semiconductor chip providers with increased capacity and world-class lab space.

"We look forward to showcasing this flagship location to our laser annealing and advanced packaging lithography customers for years to come.  Thank you to the Veeco team that worked diligently on an accelerated timeline to enable this exciting milestone in Veeco’s history.”

Veeco’s new facility features approximately 70,000 square-feet of manufacturing and engineering lab space and 30,000 square-feet of office space. Manufacturing space will be nearly double that of Veeco’s previous San Jose facility and will improve manufacturing efficiency. The new facility is specifically designed to meet growing demand for Veeco’s laser annealing and advanced packaging lithography technologies.

Advanced semiconductor device scaling requires higher temperature for dopant activation with shorter time at temperature to avoid dopant diffusion. Veeco’s patented LSA101 and LSA201 Laser Spike Annealing (LSA) Systems deliver the highest temperatures in the microsecond time scale. The unique nature of the LSA platform enables our customers to anneal complex patterns with high temperature uniformity and precision, which is highly desired in advanced device processing.