KemLab introduces breakthrough in advanced photoresist technology

The APOL-LO 3200 Series offers improved resolution, broader process latitude and unparalleled customisation capabilities, elevating semiconductor manufacturing to unprecedented heights.

Built to exceed industry standards, this high-resolution resist introduces a lift-off profile that redefines the possibilities in i-Line and broadband applications. This unlocks a host of benefits, including improved resolution, wider process latitude, and a versatile film thickness range of 2 - 10+ μm.

KemLab's commitment to pushing the boundaries of innovation is evident in the APOL-LO 3200 Series resist. Industry professionals can now benefit from customisation options that allow them to tailor the resist's performance to meet their unique requirements. This includes the ability to adjust the lift-off angle and PhotoSpeed, providing unmatched flexibility and control.

The APOL-LO 3200 Series resist is poised to rival leading industry solutions, including AZ nLOF 2020, AZ nLOF 2035, and AZ nLOF 2070. With its exceptional features and performance, KemLab's APOL-LO 3200 Series resist is positioned to elevate semiconductor manufacturing to new levels of efficiency and precision.

To cater to various needs, KemLab offers the APOL-LO 3200 Series resist in a range of sizes, including 100ml sample, 500ml, 1L, and 4L volumes. For industries requiring specific thicknesses and formulations, KemLab extends the option for custom formulations, ensuring that each solution is tailored to meet the unique demands of the manufacturing process.