Brewer Science presents optics integration at SPIE Photonics West

Transition to 3D wafer-scale integration is a challenge faced in new photonic integration projects

The transition from traditional separate manufacturing and packaging processes to 3D wafer-scale integration remains a challenge faced in any photonic integration project.

Augmented, virtual, and mixed reality bring their own unique set of optic integration challenges, including the need for materials with deep submicron processing capabilities and minimal defectivity.

Advanced CMOS processing and high-quality materials are critical for next-gen materials

Scaling wafers to smaller sizes, while increasing functionality, places an emphasis on material selection and leading-edge CMOS node capabilities. Experience in CMOS processing and access to high-quality materials are necessary to achieve higher-performing materials, including:

• Enhanced optical properties
• Increased uniformity
• Ultralow defectivity
• Improved stability across a wider temperature range

Brewer Science presented ppb-level defectivity and deep submicron processing capabilities at SPIE Photonics West

Brewer Science believes their current offerings of optics integration, include materials in some of the most innovative spaces:

• Lithography enhancement materials
• Next-generation packaging solutions
• Permanent materials including:
• High and low refractive index materials
• Protective coatings (including anti-scratch coatings)
• Transparent permanent adhesives
• PermaSOL permanent wafer bonding material