Mixed Signal/Analog

TI enhances audio headset experience with detection and configuration switch IC

15th June 2012
Nat Bowers
0
Datasheets

Texas Instruments Incorporated today introduced a new audio headset detection and configuration switch integrated circuit that enables universal headset support for audio applications in a single chip. By integrating the automatic detection and switching function in a single device, the TS3A225E eliminates detection, leakage and click-pop issues caused by using discrete components in end-equipment, such as smartphones, tablets, laptops, audio docks and home audio applications.

The TS3A225E works seamlessly to extend the functionality of best-in-class TI audio codecs, such as TLV320AIC3262 and TLV320AIC3212. For customers who prefer only a 2x2 crosspoint switch functionality without headset-type detection, TI also offers the reduced-cost TS3A26746E.



The TI switch portfolio also consists of other audio, video, USB, LAN and DDR switches available at www.ti.com/switches-pr.



Key features and benefits



• Enhances the end user’s experience: supports three-prong (without microphone) and four-prong (with microphone) audio headsets from all manufacturers.



• Eases system design: detects the configuration of the microphone and ground pins on a four-prong headset and routes them appropriately via a 2x2 crosspoint switch.



• More control over system operation and debug: reports headset information over I2C interface.

• Prevents audio signal distortion: 66-percent lower on-resistance (100 mOhms) for the ground switch compared to the competition.



• Easier mounting and routing in the system: available in both QFN and WCSP packages.



Available now, the TS3A225E is offered in 16-pin QFN and WCSP packages. Suggested retail pricing is $0.32 in 1,000-unit quantities.

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