Texas Instruments Provides OMAP-Vox™ Platform to Power the New SAGEM my700X Multimedia Handset

“With the increasingly diverse needs of today’s consumers, we have entered a new stage of mobile phone design where communications and entertainment are converging,” said Thierry Buffenoir, deputy CEO Sagem Communication. “TI’s high-performance OMAPV1030 chipset is at the heart of the new SAGEM my700X multimedia device, allowing users to download and listen to music and FM radio, watch streaming video, play 3-D games, send emails and mobile instant messaging, and take high-quality photos with a 1.3 mega-pixel camera.”

Optimized for cost-efficiencies and high performance, the OMAPV1030 is an integrated and optimized EDGE solution giving handset manufacturers the freedom to design affordable devices with the latest applications for the growing mid-range mobile phone market. The OMAPV1030 solution delivers advanced capabilities such as QCIF 30 frames per second video capture, playback and streaming; megapixel digital still camera; color LCD; and interactive 2D/3D gaming. Built on TI’s leading OMAP™ processor architecture, the OMAPV1030 solution TI’s applications processing technology for smartphones to address the demand for multimedia applications in the feature phone wireless market.

“Consumers in today’s mainstream market want the latest multimedia features on their handsets but don’t want to pay high-end prices,” said Alain Mutricy, vice president, cellular systems solutions for Texas Instruments. “Building on our strong five-year partnership with Sagem, we are pleased to provide a high-performance, cost-efficient EDGE solution that gives manufacturers an ideal migration path to deliver the most compelling multimedia applications to the mass market.”

The OMAP-Vox platform enables extensive modem and applications software re-use from EDGE to UMTS and across market segments, saving manufacturers’ time and development costs. The OMAPV1030 processor is based on the OMAP1710 architecture and runs both GSM/GPRS/EDGE modem and applications processing on a single OMAP core, leveraging ARM926TEJ and TI DSP capabilities. This architecture serves as the foundation for the scalable OMAP-Vox hardware architecture and is designed to easily extend from 2.5G to 3G and beyond. The scalability and software re-use provided by the OMAP-Vox architecture, along with TI’s DRPTM technology and process technology leadership, will enable TI to drive the OMAP-Vox family into wireless standards beyond 3G.

The Sagem my700X handset also includes TI’s BRF6150, a highly integrated Bluetooth® Specification v1.2 single-chip solution. The BRF6150 solution integrates TI’s Bluetooth baseband, digital RF, ARM7TDMI® and power management into a single chip to enhance performance, reduce cost and minimize board space.

Texas Instruments – Making Wireless
TI is the leading manufacturer of wireless semiconductors, delivering the heart of today's wireless technology and building solutions for tomorrow.  TI provides a breadth of silicon and software and 15 years of wireless systems expertise that spans handsets and base stations for all communications standards, wireless LAN, Bluetooth and Ultra Wideband. TI offers custom to turn-key solutions, including complete chipsets and reference designs, OMAP™ application processors, as well as core digital signal processor and analog technologies built on advanced semiconductor processes.  Please visit www.ti.com/wirelesspressroom for additional information.