Micros

Nuvoton Announces its New eSIO Series IC – NCT6683D

8th March 2013
ES Admin
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Nuvoton Technology Corporation proudly announces NCT6683D, the new eSIO series IC, which integrates traditional SIO with built-in uC or uP to provide the best green control on MB / AIO systems. The “e” of eSIO stands for the embedded” controller based SIO.
NCT6683D, combining a built-in microcontroller and traditional legacy SIO functions, supports a rich set of features and targets the All-in-One PC applications, high-end motherboard applications that need the built-in microcontroller to fulfill the customized features, server applications for BMC-lite segments, such as workstation, storage and cloud, and any other applications that microcontroller can better execute the performance.

The microcontroller inside NCT6683D is the industrial standard 1T 8-bit microcontroller and the firmware code is stored in an external SPI flash, which could be updated via LPC interface or PS/2 interface with special tools provided by Nuvoton. In addition to the built-in microcontroller, the features that NCT6683D implements, such as PECI (Platform Environment Control Interface), SB-TSI interface, SMBus master, DSW (Deep Sleep Well) glue logic, power supervisor, USB host, Real Time Clock (RTC), and real time Port80 display through UART TX with Nuvoton debug card or AP, make it also the up-to-date IC for both Intel® and AMD® latest generation platforms.

Moreover, NCT6683D is featured with ErP (energy related products), a more and more popular specification to further reduce the system power consumption while in S5 state nowadays, is one of them. For the conventional applications, NCT6683D is the best choice because it supports LPC interface, Printer Port, 2 UARTs, KBC and GPIO (general purpose I/O).

NCT6683D feature sets are most desirable for AIO, MB and server systems. Nuvoton has been a major supplier of the key IC components for Desktop PC motherboards, Notebook PCs, Industrial / Embedded PCs and Servers markets, and continues to devote itself to the development of creative IC components and to invest in the development of cost effective ICs with the newest characteristics and the best performance.

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